Evertech delivers turnkey electronic manufacturing services (EMS) from prototype through production. Our ISO 9001–compliant quality management system ensures consistent performance, traceability, and customer satisfaction across all projects.
Core Capabilities
Surface-Mount & Through-Hole Assembly
Stencil Printing: DEK Horizon 03iX with Hawkeye inspection for fine-pitch, BGA, and complex layouts.
Pick & Place: Mycronic MY100LXe high-speed, high-accuracy placement of 01005 to large BGAs/QFNs.
Reflow Soldering: Vitronics Soltec XPM3i multi-zone convection oven for precise lead-free profiles.
Wave Soldering: Vitronics Soltec DeltaWave for reliable through-hole and mixed-technology soldering.
Metrics and Capacity
Minimum component size: 0.4 x 0.2 mm (0.016 “x 0.008”) (01005)
Maximum board size: 17.4″ x 20″
SMT throughput: 32,000 components/hour
Reflow capacity: 120 panels/hour
Wave solder capacity: 120 panels/hour
First-pass yield: >98%
Lead time: < 10 days prototype / 4 weeks production
Quality and Process Control
ISO 9001 Compliant QMS: Documented procedures, traceability, and corrective action tracking.
Inline Process Control: Paste inspection, placement vision alignment, reflow profiling
Rework Precision: Minimizes scrap, extends product lifecycle.
Fully Lead-Free, Reach and RoHS compliant facility.